IDF Press Room

Intel Corp. President and CEO Paul Otellini displays a silicon wafer containing the world's first working chips built on 22nm manufacturing technology. The circuitry contained on each chip is so small that 2.9 billion transistors can be packed into an area the size of a fingernail.

Intel Corp. President and CEO Paul Otellini addresses more than 4000 attendees at the Intel Developer Forum in San Francisco.

Intel Corp. President and CEO Paul Otellini talks with members of the media at the conclusion of his opening keynote address at the Intel Developer Forum in San Francisco.

Sean Maloney, executive vice-president of Intel Architecture Group, holds a server module suitable for cloud computing during his IDF Fall 2009 keynote

Sean Maloney, executive vice-president of the Intel Architecture Group discusses innovation and integration during his IDF Fall 2009 keynote

Sean Maloney, executive vice-president of the Intel Architecture Group during his IDF Fall 2009 keynote

Bob Baker, Vice President of technology and manufacturing displays a silicon wafer containing the world's first working chips built on 22nm manufacturing technology. The circuitry contained on each chip is so small that 2.9 billion transistors can be packed into an area the size of a fingernail.

Bob Baker, Vice President of technology and manufacturing today describes Intel's relentless pursuit of Moore's law through materials and research, innovation in silicon technology and manufacturing capabilities.

Bob Baker, Vice President of technology and manufacturing today at the Intel Developer Forum describes how Intel continues to relentlessly pursue Moore's Law and provide its benefits to end users

Intel senior fellow Mark Bohr answers questions from the media about the world�s first working chips built on 22nm process technology.

Dadi Perlmutter, executive vice president and general manager, Intel Architecture Group, discusses what makes mobility 'cool', highlighting what users want and expect from their mobile experience. He introduced three new super-fast and intelligent Intel® Core™ i7 quad-core processors for laptops in his keynote presentation at the 2009 Intel Developer Forum on Wednesday in San Francisco.

During his keynote at the Intel Developer Forum Wednesday, Dadi Perlmutter, executive vice president and general manager, Intel Architecture Group, shows off a new prototype, "Tangent Bay", the first multitouch, multiscreen concept solution.

Dadi Perlmutter, executive vice president and general manager, Intel Architecture Group, unveils Intel's new high-speed optical cable technology codenamed "Light Peak" which will connect devices through optical fibers rather than copper wires, dramatically improving connectivity speeds and input and output I/O performance, while also reducing the number of cables needed for high-speed connections.

Peter Cannistra, vice president, embedded devices, Clearwire, joins Dadi Perlmutter on stage at the Intel Developer Forum to explain how Intel and Clearwire bring wireless broadband connectivity worldwide through commercial WiMAX. Cannistra later gave a video conferencing demo illustrating the fundamental differences between 4G WiMAX and 3G technologies in uplink speed and quality of video.

Renee James, vice president and general manager, Software and Services Group, discusses how Intel helps software developers translate their creative visions into experiences on Intel Architecture.

Renee James, vice president and general manager, Software and Services Group, discusses the newly launched Intel Atom Developer Program with Peter Biddle, Director, Atom Software Strategy.

Renee James, vice president and general manager, Software and Services Group, is joined by John Thode, vice president and general manager, Dell Consumer Products, Small Screen Devices and Mark Shuttleworth, Canonical CEO, to announce the availability of the Dell Inspiron Mini 10v with Ubuntu Moblin Remix Developer Edition, a netbook that incorporates Canonical�s Moblin v2-based operating system.

Renee James, vice president and general manager, Software and Services Group, announces the Intel Media SDK, which helps media application developers boost hardware acceleration on current and future Intel processors and chipsets.

Mooly Eden, general manager, PC Client Group, senior vice president, Intel, demonstrates the difference between Intel's new Intel® Core™ i7 processor and the Ibex peak chipset during his megabriefing at the Intel Developer Forum in San Francisco. The Intel® Core™ i7 chips deliver unmatched processing power on-the-go for the most demanding PC users who create digital video, play intense games or run compute-intensive business applications.

In a megabriefing at the Intel Developer Forum in San Francisco on Wednesday, Mooly Eden, general manager, PC Client Group, senior vice president, Intel, presented to attendees the new Intel® Core™ i7 processor. He outlined why the Intel® Core™ i7 processor is the choice for multimedia enthusiasts and gamers, sharing metrics on its impressive performance and speed for movies video, photos and other immersive content.

Mooly Eden, general manager, PC Client Group, senior vice president, Intel, walks through the new Intel® Core™ i7 processors and a new chipset which include such features as Intel® Turbo Boost Technology and Intel Hyper-Threading Technology.

Eric Kim, senior VP and general manager, Intel Digital Home Group, announces the Intel® Atom™ Media Processor CE4100, the newest CE System-on-Chip.

Levar Burton from Star Trek: The Next Generation -- joins Intel executive Eric Kim on stage to discuss TV innovation and the company�s new CE System-on-Chip.

Intel CTO and senior fellow Rattner predicts that high-quality 3-D video will someday soon be consumed in the privacy of your own living room and demonstrates larger than life 3D onstage at the Intel Developer Forum.

Intel CTO Justin Rattner describes what users can expect the TV experience to be like in the year 2015

Die shot of the Nehalem-EP based processor, codenamed "Jasper Forest"
Tech bulletin: Tech bulletin: Future Family of Low-Power Integrated Intel® Xeon® Embedded Processors for Communications and Storage (PDF 108KB)